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The AMD Sempron SD2650 is a powerful processor designed for basic computer applications. With a clock speed of 1.45 GHz and two cores, it offers solid performance for everyday tasks such as web browsing, word processing, and multimedia applications. The processor is housed in the AM1 socket and has a maximum Thermal Design Power (TDP) of just 25 watts, making it an energy-efficient choice for compact systems. The integrated Radeon HD 8280 graphics unit provides appealing graphics performance without the need for a separate graphics card. With a 1 MB L3 cache and a 28 nm lithography, the Sempron SD2650 is designed to deliver balanced performance while maintaining low power consumption. These features make it a suitable option for users who need a reliable and cost-effective system.

- 2-core processor with a clock speed of 1.45 GHz
- Maximum TDP of just 25 watts for energy-efficient use
- Integrated Radeon HD 8280 graphics unit for basic graphics performance
- 1 MB L3 cache to enhance data processing
- Compatible with DDR3 RAM for flexible memory options.

Actual product image AMD CPU Sempron SD2650/1450MHz, AM1 (AM1, 1.45 GHz, 2 -Core)

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Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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AMD CPU Sempron SD2650/1450MHz, AM1

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