Name: EPYC 9124 - 3 GHz - 16 cores - 32 Th
Brand: AMD
SKU: 32425500
Price: 1243.15 EUR
Availability: InStock

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The AMD EPYC 9124 processor is a powerful CPU specifically designed for server applications. With a base clock frequency of 3 GHz and the ability to reach up to 3.7 GHz in turbo mode, this processor delivers impressive performance for demanding tasks. It features 16 cores and supports 32 threads, enabling efficient processing of multiple tasks simultaneously. The EPYC 9124 is equipped with a 64 MB L3 cache, further optimizing data processing speed. The processor uses the SP5 socket and supports DDR5 SDRAM with a maximum memory clock rate of 4800 MHz, making it a future-proof choice for modern server architectures. With a maximum power consumption of 200 watts and advanced 5 nm technology, the EPYC 9124 is both powerful and energy-efficient. This combination of high performance and efficiency makes it ideal for use in data centers and for businesses that rely on reliable server solutions.

- Dodeca-channel memory support for enhanced bandwidth
- Maximum turbo clock frequency of 3.7 GHz for additional performance
- Supports PCI Express 5 for faster data transfers
- Optimized for use in server and workstation environments
- 64-bit processor architecture for extended compatibility.

Actual product image AMD EPYC 9124 - 3 GHz - 16 cores - 32 Th (SP5, 3 GHz, 16 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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