Name: Epyc 9965
Brand: AMD
SKU: 54139288
Price: 10109 EUR
Availability: InStock

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The AMD Epyc 9965 is a powerful processor designed for demanding computing applications. With a clock speed of 2.25 GHz and an impressive 192 cores, this processor offers high parallel processing capability, which is essential for modern server and cloud environments. Support for 384 threads enables efficient resource utilisation, which significantly increases performance in multitasking applications. The processor is equipped with a generous L3 cache of 384 MB, which optimises data processing speed and improves overall performance. The AMD Epyc 9965 utilises the SP5 socket, making it a flexible choice for various server configurations. This OEM processor is ideal for companies looking for a robust and scalable solution for their data centres to efficiently handle complex workloads. The combination of high core count, extensive thread support and large cache makes the AMD Epyc 9965 an excellent choice for professional computing applications.

Actual product image AMD Epyc 9965 (SP5, 2.25 GHz, 192 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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