Name: Ryzen 5 PRO 4650G
Brand: AMD
SKU: 15229350
Price: 330.31 EUR
Availability: InStock
Rating: 4.33 (3 reviews)

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The AMD Ryzen 5 PRO 4650G is a powerful processor designed specifically for modern business needs. With a base clock speed of 3.7 GHz and the ability to reach up to 4.2 GHz in Turbo mode, this processor delivers impressive performance for multitasking and demanding applications. It features 6 cores and 12 threads, allowing for efficient processing of multiple tasks simultaneously. The integrated Radeon Graphics chip enhances graphics performance without the need for a separate graphics card. The Ryzen 5 PRO 4650G is equipped with an 8 MB cache that accelerates data processing and optimizes overall performance. With a 7 nm manufacturing process, this processor offers high energy efficiency and a Thermal Design Power (TDP) of only 65 watts, making it an environmentally friendly choice for businesses. The processor is compatible with the AM4 socket and supports dual-channel memory, increasing flexibility in memory selection.

- AMD PRO technologies for enhanced security and longevity
- Integrated Radeon Graphics for improved graphics performance
- Efficient 7 nm manufacturing process for lower energy consumption
- Maximum Turbo clock speed of 4.2 GHz for additional performance
- Dual-channel memory support for enhanced data processing.

Actual product image AMD Ryzen 5 PRO 4650G (AM4, 3.70 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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