The cooling system specifically developed by GIGABYTE features a 90mm fan with unique blades that provide effective heat dissipation for higher performance at lower temperatures. The airflow is divided by the triangular fan edge and evenly directed through the 3D stripe curve on the fan surface. MOSFETs with low RDS(on) have been specially designed to achieve lower switching resistance for faster charging and discharging of power at extremely low temperatures. The fully automated production process ensures high quality of the circuit boards and avoids sharp protrusions of the solder joints, as seen on traditional circuit board surfaces. This user-friendly design prevents you from cutting your hands or accidentally damaging components while assembling your parts.