Name: Intel Xeon Six-Core processor
Brand: HP
SKU: 18061901
Price: 1569 EUR
Availability: InStock

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The Intel Xeon Six-Core Processor is a powerful CPU designed for demanding server and workstation applications. With a clock speed of 2.4 GHz and six processor cores, this processor offers efficient processing of multithreaded applications. The architecture of the processor supports 64-bit operating systems and enables high data processing speeds. The processor is equipped with a 12 MB L3 cache, further enhancing performance in data-intensive tasks. Thanks to support for virtualization technologies such as VT-x and VT-d, the Xeon E5645 is ideal for virtualized environments and server applications. The triple-channel memory architecture allows for improved memory bandwidth, which is beneficial for compute-intensive applications. With a maximum Thermal Design Power (TDP) of 80 watts, the processor is energy-efficient and well-suited for servers that require high performance while maintaining low energy consumption.

- Processor socket: LGA 1366
- Maximum Turbo clock speed: 2.4 GHz
- Support for triple-channel memory architecture
- Intel virtualization technologies (VT-x and VT-d)
- Lithography: 32 nanometers.

Actual product image HP Intel Xeon Six-Core processor (LGA 1366, 2.40 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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