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The Intel Xeon E5-2620 v2 is a powerful processor specifically designed for use in server environments. With a clock speed of 2.1 GHz and the ability to reach up to 2.6 GHz in Turbo mode, this processor delivers high computing power for demanding applications. It belongs to the Intel® Xeon® E5-v2 processor family and supports up to 768 GB of DDR3 SDRAM, making it ideal for memory-intensive tasks. The processor is equipped with an LGA 2011 socket and features six cores and twelve threads, allowing for efficient multitasking. The four memory channels ensure optimal bandwidth and performance, while support for AVX instruction sets enhances the processing of complex calculations. Therefore, the Intel Xeon E5-2620 v2 is an excellent choice for businesses seeking a reliable and powerful server solution.

- Processor architecture: 64-bit
- Maximum internal memory: 768 GB
- Number of processor cores: 6
- Maximum TDP: 80 Watts
- Supported instruction sets: AVX.

Actual product image HPE Intel Xeon E5-2620 v2 (LGA 2011, 2.10 GHz, 6 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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