Name: CPU||Desktop|Core i9|I9-12900KF|3200 MHz|Cores 16|30MB|Socket LGA1700|125 Watts|BOX|BX807151290
Brand: Intel
SKU: 21336335
Price: 563.33 EUR
Availability: InStock

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Intel

The Intel Core i9-12900KF is a powerful desktop processor designed for demanding applications and gaming. With a base clock speed of 3200 MHz and a maximum turbo frequency of 5200 MHz, this processor delivers impressive performance, making it ideal for multitasking and compute-intensive tasks. The i9-12900KF features 16 cores that enable efficient data processing and a generous 30 MB cache that further enhances speed and efficiency in data handling. The processor is compatible with the LGA 1700 socket and has a thermal design power (TDP) of 125 watts, making it an excellent choice for high-performance desktop systems. Support for DDR4 RAM ensures high memory bandwidth necessary for modern applications. The boxed packaging provides additional protection and easy installation.

- Maximum turbo frequency of 5200 MHz for extra performance
- 16 processor cores for efficient multitasking
- 30 MB cache for improved data processing speed
- Compatible with LGA 1700 socket for modern motherboards
- Supports DDR4 RAM for high memory bandwidth.

Actual product image Intel CPU||Desktop|Core i9|I9-12900KF|3200 MHz|Cores 16|30MB|Socket LGA1700|125 Watts|BOX|BX807151290 (LGA 1700, 3.20 GHz, 16 -Core)

Key specifications

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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CPU||Desktop|Core i9|I9-12900KF|3200 MHz|Cores 16|30MB|Socket LGA1700|125 Watts|BOX|BX807151290

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Intel CPU||Desktop|Core i9|I9-12900KF|3200 MHz|Cores 16|30MB|Socket LGA1700|125 Watts|BOX|BX807151290

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Intel CPU||Desktop|Core i9|I9-12900KF|3200 MHz|Cores 16|30MB|Socket LGA1700|125 Watts|BOX|BX807151290

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