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Intel

The Pentium G3220 BOX is a powerful dual-core processor suitable for a variety of applications. With a clock speed of 3 GHz, it delivers solid performance for everyday tasks and multimedia applications. The integrated Intel HD Graphics provides appealing graphics rendering, while support for up to three monitors enhances usability flexibility. The processor is manufactured using a 22-nanometer lithography, resulting in efficient energy consumption, with a maximum thermal design power (TDP) of just 54 watts. Support for virtualization technologies and various Intel technologies such as Thermal Monitoring enables improved system stability and performance.

- Dual-core architecture with a 3 GHz clock speed
- Integrated Intel HD Graphics for enhanced graphics performance
- Support for up to three monitors
- Efficient 22-nanometer lithography
- Compatible with DDR3L RAM and dual-channel memory.

Actual product image Intel Pentium G3220 BOX (LGA 1150, 3 GHz, 2 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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