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Intel

The Intel Xeon E5-2697V3 is a powerful processor designed for demanding applications and server environments. With a base clock frequency of 2.6 GHz and the ability to reach up to 3.6 GHz in Turbo mode, this processor offers high computational performance. The 14 cores and 28 threads enable efficient processing of multiple tasks simultaneously, making it ideal for multitasking and compute-intensive applications. The 22 nm manufacturing technology ensures improved energy efficiency and performance. With a maximum thermal design power (TDP) of 145 W, the E5-2697V3 is designed to be used in high-performance systems without generating excessive heat. The processor is compatible with the LGA 2011-3 socket and offers extensive cache memory options that further optimize data processing speed.

- 14 processor cores and 28 threads for high multitasking performance
- Maximum Turbo clock frequency of 3.6 GHz for additional performance when needed
- 22 nm manufacturing technology for improved energy efficiency
- 35 MB L3 cache to optimize data processing speed
- Compatible with LGA 2011-3 socket for versatile applications.

Actual product image Intel Xeon Fourteen Core E5-2697V3, 2.6GHz (LGA 2011-v3, 2.60 GHz, 14 -Core)

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Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

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Intel Xeon Fourteen Core E5-2697V3, 2.6GHz

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