Name: Xeon Ten Core E5-2690v2, 3.0GHz, 22nm
Brand: Intel
SKU: 6056366
Rating: 1 (1 reviews)

isSSR

offer

olderThan3MonthTimestamp

path

sectorId

shopArea

slug

tagIds

productDetailPageQuery

productBySlug

alternateLinks

dutchAuctionBannerLazy

alternateLinksByPath

currentAuctionEvent

Intel

Now with improved performance, efficiency, and security, your cloud solutions are better equipped.

The explosive growth of unstructured data presents new demands on your network and storage infrastructure and poses a challenge for the delivery of new services such as cloud computing. IT must quickly respond to new and changing operational requirements, manage fluctuating workloads through rapid and appropriate scaling, accommodate business expansions, protect your data from cybercriminals – all while keeping costs low.

Invest in a flexible foundation.

The new Intel® Xeon® E5-2600 and E5-1600 v2 processors are at the heart of a flexible and efficient data center that meets your diverse needs. Now you can implement a private cloud with enhanced security, process big data effortlessly and quickly, and maximize the efficiency of your data center with higher energy savings.

Actual product image Intel Xeon Ten Core E5-2690v2, 3.0GHz, 22nm (LGA 2011, 3 GHz, 10 -Core)

Key specifications

Processor family

Number of processor cores

A multi-core processor (or chip-level multiprocessor, CMP) combines two or more independent cores (normally a CPU) into a single package composed of a single integrated circuit (IC), called a die, or more dies packaged together. A dual-core processor contains two cores, and a quad-core processor contains four cores.

Max. TDP

The thermal design power (TDP), sometimes called thermal design point, refers to the maximum amount of power the cooling system in a computer is required to dissipate. For example, a laptop's CPU cooling system may be designed for a 20 watt TDP, which means that it can dissipate up to 20 watts of heat without exceeding the maximum junction temperature for the computer chip. It can do this using an active cooling method such as a fan or any of the three passive cooling methods, convection, thermal radiation or conduction. Typically, a combination of methods is used. The TDP is typically not the most power the chip could ever draw, such as by a power virus, but rather the maximum power that it would draw when running "real applications". This ensures the computer will be able to handle essentially all applications without exceeding its thermal envelope, or requiring a cooling system for the maximum theoretical power (which would cost more but in favor of extra headroom for processing power).

Your data. Your choice.

Search

Intel Xeon Ten Core E5-2690v2, 3.0GHz, 22nm

Product details

Compare products

Goes with

Reviews & Ratings

Intel Xeon Ten Core E5-2690v2, 3.0GHz, 22nm

Similar products with faster delivery

Product details

Description

Specifications

Price trend

Compare products

Sales rank in Processors

Goes with

Accessories

Reviews & Ratings

Warranty & return rates

Questions about this product

Product ratings1