Zalman STC8 thermal compound
8.30 W/m K, 1.50 gPrice in EUR including VAT
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Zalman ZM-STC8 Thermal Paste 1.5g - 8.3 W/mK Thermal Conductivity
The Zalman ZM-STC8 thermal paste, with a thermal conductivity of 8.3 W/mK, offers an excellent solution for cooling high-performance processors and graphics cards. With its high efficiency in heat transfer, this thermal paste is ideal for gaming PCs, workstations, and other high-performance systems that require constant and effective cooling.
With a content of 1.5g, the ZM-STC8 paste is optimal for specific applications and is perfect when precise dosing and maximum cooling performance are required. Its fine, smooth texture allows for easy and even application, ensuring it reliably fills even the smallest gaps. The paste is non-conductive, which enhances the safety of sensitive hardware components.
Key features of the Zalman ZM-STC8 thermal paste:
Choose the Zalman ZM-STC8 thermal paste to efficiently cool your CPU or GPU and ensure optimal performance - ideal for anyone seeking maximum cooling power and protection in one product.
Weight | 1.50 g |
Max. temperature | 200 °C |
Item number | 12859625 |
Manufacturer | Zalman |
Category | Thermal grease |
Manufacturer no. | ZM-STC8 |
Release date | 6-3-2020 |
Thermal paste type | Heat sink compound |
Thermal conductivity | 8.30 W/m K |
Max. temperature | 200 °C |
CO₂-Emission | |
Climate contribution |
Weight | 1.50 g |
Length | 9.40 cm |
Width | 4.20 cm |
Height | 1.90 cm |
Weight | 10 g |
Product Safety |
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